Senior Photonics Packaging Engineer
Taara
Taara focuses on increasing access to abundant and affordable internet with beams of light (Wireless Optical Communication). Like fiber, but without the cables, Taara uses wireless optical communication to transmit data at super high speeds through the air as a very narrow, invisible beam. Taara has helped bridge a particularly stubborn connectivity gap between Brazzaville (Republic of Congo) and Kinshasa (Democratic Republic of Congo) across the Congo river. More on this topic is available here and more on Taara here.
About the Role:
The successful candidate will design and implement packaging solutions for micro-optic assemblies of Si photonic and III-V dies at outsourced semiconductor assembly and test vendors. The role requires deep knowledge in photonic packaging design, simulation, optimization, assembly and testing. The position seeks highly-motivated individuals who thrive in ambiguity and enjoy working in a small dynamic team environment, with a passion for solving challenging problems that can lead to high-impact advances in technology.
How you will make 10x impact:
Develop and implement novel photonic assembly and packaging.
Optimize assemblies for manufacturability and reliability.
Contribute to system-level optimization and product strategy.
Be motivated by making the world a better place through technology, and wanting to be part of a team that makes this happen.
What you should have:
M.S. in Electrical Engineering, Applied Physics or related field
Five (5) or more years relevant industry experience with demonstrated achievements in photonic packaging
Experience with optical simulation software (Zemax, Lumerical, Flexcompute or equivalent)
Experience with thermo-mechanical simulations (Ansys, Altair, Siemens, or equivalent).
Experience with optimization of packaging towards manufacturability and reliability.
Experience working with outsourced semiconductor assembly and test vendors.
Experience with failure analysis, parts inspection and testing.
It would be great if you also had these:
Ph.D. in Electrical Engineering, Materials Science, Applied Physics or related field
Experience with microelectronic assembly processes such as 3D and 2.5D assemblies
Excellent communication and presentation skills (writing and delivering presentations), can work with senior external partners with ease.
Hands-on experience in advancing product from prototype to final production stage
The US base salary range for this full-time position is $160,000 - $210,000 + bonus + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your location during the hiring process.
