One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.
What you'll do
In this role, you will have the opportunity to be a team member with other top notch mechanical engineers. Your experience in physical design of microelectronics hardware will be valued as you become the go to person in performing design, analysis, and test for commercial, military, or space hardware. You will be empowered to make positive contributions and decisions in design, testing, and prototype fabrication. Your people skills will come to play as you work closely with teammates, subcontractors, and our customers.
The day-to-day
You will work with a talented team of mechanical engineers, RF and digital engineers, systems engineering, and manufacturing to develop electronic packaging for a wide range of applications. Tasks may include conceptual design, detailed design, tolerance analysis, thermal analysis, structural analysis, build support, and environmental test preparation and execution.
What you'll need
- 8+ years of experience of RF/Microwave module level electronic packaging design or similar work.
- Experience with CAD tools such as SolidWorks.
- Ability to perform thermal analysis of electronic packaging design.
- Knowledge of finite element modeling techniques and software.
- Knowledge of packaging microwave electronics for space environments.
- Bachelor's Degree in Mechanical Engineering.
- US Government position. US Citizenship required.
- Ability to travel up to 10%.
What will help you on the job
- Master
sof Science Degree in Mechanical Engineering. - Experience with the following CAD tools: Solid Edge and Creo.
- Experience with the following analysis tools: ANSYS, NASTRAN, and Thermal Desktop.
- Experience with Phased Array Antenna packaging.
- Experience with packaging for space applications: LEO, MEO, and GEO.
- Experience with design for high volume production.
- Experience with die casting design and documentation.
- Experience with CFD/Convection Analysis for terrestrial hardware.
- Knowledge of government and military standards.
- Current security clearance or ability to obtain one.
Salary range
$132,400.00 - $230,200.00 / annually
At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat’s comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits.
EEO statement
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.
